Wafer Inspection System is to inspect defects on the surface with High-tech Vision Camera before die bonding process. If any defects found, it updates mapping on screen or mark on the surface of wafers.

Applicable for 6, 8, and 12 inch Wafer. Accuracy: 3um flatness, 4KD TDI or 8K Line scan camera.
Detectable defects: Crack, Dust, Chipping, Metal Pin hole, Saw Missing, Pattern, Scratch, No marking and etc.

Wafer Tape Mount System is to attach a Dicing tape on the back side of wafer for sawing process. It has non-contact wafer handing system to protect wafer surface.

Applicable for 6, 8 and 12 inch Wafer, Non-contact Wafer Mounting (Air Floating), Mounting Accuracy: 0.5mm and 0.5Degree, Normal UV and Pre-cut Tape is available.

Wafer Sorting System is to sort wafers from Cassette, FOUP, Coin Jar ot Canister to other to the carriers using Robot hand(s).

Applicable for 6, 8 and 12 inch Wafer, Can be equipped maximum 4 cassettes (or FOUP), Single or Dual Arm Robot, High Accuracy Pre-aligner.

Glass Measurement System is a system that transport glass to Inspection area safely using non-contact magnetic rollers. This System is optimized to protect glass breakage and breakaway.

Applicable for any Glass, Thickness Measuring Accuracy: 2um, 2D Code Reader.

Tape and Reel System is to inspect a surface of molded package and leads condition using High-tech Vision Camera. If any defects found, it marks on the surface or replace with good units.

Applicable for any packages such as QFP, SOIC, PDIP, SOT, TO and etc. Accuracy: 10um, 1.3K Area Scan Camera, Detectable defects: Crack, Chip-out, Bended Lead(Align), Upside down, Empty pocket, Marking Condition, Exposed Wire and etc.

Auto Frame Loader is to place leadframes on a work loading frame on a hot plate duting moding process.

Aplicable for any packages such as BGA, QFN, QFP, SOIC, PDIP SOT, TO and etc. Single or Dual Pick and Place, Compact Size, Adjustable Temperature Controller.

Laser Marking System is to print words, numbers or logo on Wafers or Package surface to have identification.

Applicabe for Wafers and Packages. CO2, Nd;Yag, UV or Green Laser is available, Compact Size, Vision Camera for marking quality is available.