Laser Line Scan Method
Fastest Inspection Speed in the Industry
Real 3D Image
Inspection Irrelevant to Color, Material, Surface Roughness
Inspection of up to 65mm Height
Foreign Material & Contamination, PCB Warpage, Inspection without Additional Cycle Time
Safety Cut-off / Shut-Down
Inspection Items Dimension, Missing, Misalignment, Wrong, Side Mount, Tombstone, Text(OCR/OCV), Solder Joint, Lead Lift, Lead Missing, Lead Offset, Bridge, Color Band, Pin, Coplanarity, etc.

Laser Line Scan Method
Component, Solder, and Conformal Coating Inspection with One Machine
Foreign Material & Contamination, PCB Warpage, Inspection without Additional Cycle Time
Application Software Type according to User Needs (SPI/AOI/CCI)
Inspection Items SMD, Solder Paste, Epoxy, Conformal Coating, etc.

Ultra-Precision 2D&3D AOI for Wirebonding
Magazine Loader/Unloader Built-in Type
Extremely Fast and High-Resolution Inspection Capability
Inspection of a Minimum Diameter of Ø 0.6 mil Wire (Cu, Au, Al)
Inspection Items SMD, Solder Paste, Epoxy, Conformal Coating, etc.

Laser Line Scan Method
Fastest Inspection Speed in the Industry
Real 3D Image
Inspection Irrelevant to Color, Material, Surface Roughness
Automated Measurement of PCB Warpage
Automated Compensation of PCB Stretch and Shrinkage
Process Optimization with Feedback & Feedforward Linkage Support
Inspection Items Height, Area, Volume, Offset, Bridge, Shape, PCB Warpage, PCB Shrink, etc.