• AKLC400_A Lubricant Series is a biodegradable water based lubricant.
• DI /RO water: cutting/slicing fluid is 300:1 to 500 :1
• Excellent wetting and rinsing properties
• Reduces the surface tension of cutting/slicing water solution to about 22.0 to 25.0 mN/m
• Increases heat transfer (heat dissipation) thereby reducing thermal stress
• Prevents silicon swarf agglomeration, allowing for easier cutting and burr reduction

Environmental Benefits and Cost

• Biodegradable, non-hazardous and easily disposable
• Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L)
• Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L)

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AKLC300_A De-Glue is a biodegradable water-based, non-caustic and non-acidic material.

• PV wafer De-glue or De-bonding after wafering process.
• DI /RO water: Detergent dilution ratio – 10:1 to 30 :1.
• Application temperature 25°C to 70°C.
• Excellent wetting, De-bonding and rinsing properties.
• Water surface tension reducer.

AKLC300_B Detergent is a biodegradable water based, non-caustic and non-acidic material

• PV wafer cleaning after wafering.
• DI /RO water: Detergent dilution ratio – 10:1 to 50 :1.
• Application temperature 45°C to 70°C.
• Excellent wetting, de-bonding and rinsing properties.
• Water surface tension reducer.
• Completely cleans out SiC (silicon carbide) dust and other contaminants on wafer surfaces.
• Eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process.
• Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L).
• Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L).

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